Chantilly, Virginia, U.S.A.
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Products

Semiconductor & Data Center Precision Components

CNC-machined chamber, wafer-handling, and thermal/RF hardware — electropolished stainless, anodized aluminum, and nickel alloys to ten-thousandth-inch tolerances.

Who Needs This

Who this is built for

Semiconductor equipment builders and data center hardware OEMs sourcing ultra-clean, tight-tolerance metal components for chamber, wafer-handling, thermal, and RF applications.

Semiconductor & Data Center Precision Components

Specifications

Specs & configuration range

Materials 316L stainless (electropolished), 6061-T6 aluminum (anodized), Inconel/Hastelloy for high-temp service
Tolerance To ±0.0002 in. (0.005 mm) on critical features
Surface treatment Electropolishing, Type III hardcoat anodizing, cleanroom-compatible cleaning
Typical run size Prototype and first article through high-volume rack/chassis production
Semiconductor & Data Center Precision Components manufacturing process

Materials

Common materials

  • 316L stainless steel (electropolished)
  • 6061-T6 aluminum (anodized)
  • Nickel alloys (Inconel, Hastelloy)

Why Oakmet

Why source this through Oakmet

Sourcing partners experienced with vacuum chamber, wafer-handling, and RF/thermal hardware
Electropolishing, anodizing, and cleanroom-compatible packaging coordinated before shipment
First article inspection and dimensional documentation on ten-thousandth-inch tolerances
Design-for-manufacturability review for rack-scale, high-volume data center hardware

Related

Related capabilities, materials & industries

Related Materials

Related Industries

FAQ

Semiconductor & Data Center Precision Components questions

Can you machine components for ultra-high-vacuum chamber use?

Yes — we source through partners experienced in low-outgassing, particulate-controlled machining for UHV and plasma chamber environments; specify your cleanliness and finish requirements with the RFQ.

What surface finishes do you support for contamination control?

Electropolishing and Type III hardcoat anodizing are standard offerings for chamber and wafer-handling components; other finishes can be reviewed on request.

Can you support high-volume data center chassis and heatsink production?

Yes — design-for-manufacturability review and high-volume CNC and die-casting sourcing are available for rack-scale thermal and structural hardware.

Ready to quote your semiconductor & data center precision components?

Send your drawing, material, and program details. Oakmet will review and respond with next-step feedback.